Pan-Semiconductor Optics & Data Center

The core components of this industry have extremely high precision requirements, and minor defects will affect product performance. The combined technology can achieve precise cleaning and non-destructive testing.

Body & Structural Parts

Wafers, Ceramics, Glass & IC Substrates: Laser cleaning removes micro-pollutants and dicing residues; phased array detects internal cracks and delamination.

Optical Communication & High-Speed Components: Laser cleaning for coupling surfaces and bonding pads; phased array inspects packaging and welding defects.

Value: Guarantee high-bandwidth & low-latency transmission, improve yield and reliability.

  • Remove micro pollutants
  • Detect hidden cracks
  • Ensure signal stability
  • Raise yield reliability
Contact Us